2019 LPKF Microline 2115CI Laser Cutting
103
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60521251
277568
Tue Oct 29 10:00:00 UTC 2024
2019 LPKF Microline 2115CI Laser Cutting Manual loading & unloading of flexible circuit panel; Precise UV laser cutting system separating of rigid, rigid-flex and flexible PCBs and cover layers; Material fixation vacuum table & working area : 350 X 350 X 11MM; 15w UV laser class 1 with 355nm wavelength; Positioning accuracy �?25 �m, Diameter of focused laser beam
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Auction Date & Time

Tue, Oct 29, 2024 10:00AM

Etc/GMT+7

Preview

By appointment only.

Location

Ayutthaya

2019 LPKF Microline 2115CI Laser Cutting

2019 LPKF Microline 2115CI Laser Cutting Manual loading & unloading of flexible circuit panel; Precise UV laser cutting system separating of rigid, rigid-flex and flexible PCBs and cover layers; Material fixation vacuum table & working area : 350 X 350 X 11MM; 15w UV laser class 1 with 355nm wavelength; Positioning accuracy �?25 �m, Diameter of focused laser beam